PRODUCTDiamond Wheel

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Diamond Wheel Vitrified Bond

C Series

C31/C32/C33

Versatile vitrified diamond wheel

Features of C bond series
  • Wide range of grit size is available.(#80 to over #1000)
  • Low to middle conc. is available.
  • Very sharp-cutting. Applicable to soft or hard materials, such as solder resist and sapphire for example.

■Successful cases of C series

Work-piece：Ceramics plate
Wheel shape：6A2 φ150 5W
Spec.：SD 100~1000 V

Work-piece：sintered alumina substrate
Wheel shape：6A2 φ150 5W
Spec.：SD 80~800 V
Work-piece：Sapphire wafer (φ3～6in.)
Wheel shape：6A2 φ300 5W
Spec.：SSD 200 V C32

Diamond Wheel Resinoid Bond

G Series

G10/G20

Standard diamond wheel

G series are very versatile because these can be sharp-cutting or long-life type by

  • G10　High thermal conductivity with excellent cutting sharpness
  • G20　High wear resistance preventing shape deformation

K Series

K10/K20

Diamond wheel with outstanding sharpness

K series are specially designed for hard-to-grind materials such as aluminum alloys, ceramics and sapphire.

Recommended materials to grind
  • Cemented carbide
  • Ceramics materials like SiC, Alumina, Silicon nitride
  • Aluminum alloys and other non-ferrous metals

KC Series

KC1/KC2

Focused on sharpness bond use for diamond abrasive

Features of KC bond series
  • Adding special bond filler to K series bond
    Good truing/dressing properties. The bond matrix retreats easily, ensuring a stable amount of protrusion of the abrasive grains and extending the interval.
Recommended grinding application

Insert tip processing (carbide, cermet), Constant pressure grinding, Spring grinding, Hard brittle material processing, Fine grain processing.